BGA HEAT SINKS

Compatible with ball grid array (BGA) devices, our BGA heat sinks are made from aluminum with a black anodized finish. These BGA heat sink models support a wide range of sizes from 8.5 x 8.5 mm up to 60 x 60 mm with profiles from 6 mm up to 25 mm. Measured under four conditions for thermal resistance, our BGA heat sinks carry power dissipation ratings from 1.92 up to 15.83 W at 75°C. As adhesive or PCB mount devices, our BGA heat sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.

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