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BGA Heat Sinks
BGA Heat Sinks
Compatible with ball grid array (BGA) devices, CUI Devices’ BGA heat sinks are made from aluminum with a black anodized finish and feature adhesive or PCB mounting. Our BGA heat sinks support a wide range of sizes from 8.5 x 8.5 mm up to 60 x 60 mm with profiles from 6 to 25 mm. Measured under four conditions for thermal resistance, our BGA heat sinks carry power dissipation ratings from 1.92 up to 15.83 W at 75°C.
Mounting Style
Adhesive
PCB
Reset
Rth @ 75°C ΔT, nat conv (°C/W)
Min
Max
GO
4.74
6.41
6.65
7.56
7.62
7.96
8.35
8.97
11.11
11.63
11.84
12.23
12.36
13.7
15.19
15.41
17.39
18.1
19.59
20.41
23.68
23.91
24.01
24.08
25.4
25.46
29.73
35.98
37.9
39.1
Reset
Rth @ 1 W, nat conv (°C/W)
Min
Max
GO
5.1
7.9
9
9.6
9.9
10.1
11.1
12.7
13.8
14.7
14.8
16.1
16.8
17.9
18.2
21.3
22.5
23
24
24.5
28.8
29.1
29.2
31.2
39.7
41.9
43.3
Reset
Rth @ 1 W, 200 LFM (°C/W)
Min
Max
GO
1.4
2.1
2.6
2.7
2.8
3.6
3.8
3.9
4
4.5
4.7
5.1
5.3
6
6.5
6.8
7.8
8.4
8.6
8.8
9.6
9.7
13.1
15.8
16
16.5
Reset
Rth @ 1 W, 400 LFM (°C/W)
Min
Max
GO
0.9
1.5
1.6
1.9
2.1
2.4
2.6
3
3.1
3.2
3.3
3.4
4
4.3
4.7
5.7
5.8
6
6.1
6.7
6.8
9.3
11.2
11.6
12.3
Reset
PD @ 75°C ΔT, nat conv (W)
Min
Max
GO
1.92
1.98
2.08
2.52
2.95
3.11
3.12
3.14
3.17
3.67
3.83
4.14
4.31
4.87
4.94
5.47
6.07
6.13
6.33
6.45
6.75
8.36
8.98
9.43
9.84
9.92
11.28
11.69
15.83
Reset
Length (mm)
Min
Max
GO
8.5
10
12
14
17
18
20
21
23
25
27
28.5
30.7
33.5
35
37.4
40
43.1
45
60
Reset
Width (mm)
Min
Max
GO
8.5
10
12
14
17
18
20
21
23
25
27
28.5
30.7
33.5
35
37.4
40
43.1
45
60
Reset
Height (mm)
Min
Max
GO
6
7
8
9
10
11.5
14.1
15
16.51
18
22
25
Reset
Rth = Thermal Resistance, PD = Power Dissipation
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