HSB30-373710

HSB30-373710
HSB30-373710 Alternate View

HSB30-373710

37.4 x 37.4 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 11.63
Thermal Resistance @ 1 W, nat conv (°C/W) 13.8
Thermal Resistance @ 1 W, 200 LFM (°C/W) 4
Thermal Resistance @ 1 W, 400 LFM (°C/W) 2.4
Power Dissipation @ 75°C ΔT, nat conv (W) 6.45
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 37.4 x 37.4 x 10
Dimensions LxWxH (in) 1.47 x 1.47 x 0.39

Technical Docs

Datasheet

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