HSB25-282810

HSB25-282810
HSB25-282810 Alternate View

HSB25-282810

28.5 x 28.5 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 15.41
Thermal Resistance @ 1 W, nat conv (°C/W) 18.2
Thermal Resistance @ 1 W, 200 LFM (°C/W) 5.1
Thermal Resistance @ 1 W, 400 LFM (°C/W) 3
Power Dissipation @ 75°C ΔT, nat conv (W) 4.87
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 28.5 x 28.5 x 10
Dimensions LxWxH (in) 1.12 x 1.12 x 0.39

Technical Docs

Datasheet

Buy from CUI Devices

Loading...

Shop our distributors

Featured Products

All Heat Sinks Categories