Improve Heat Dissipation with Board Level and BGA Heat Sinks

Our board level and BGA heat sinks are the ideal solution for improving the heat dissipation of both low and high-power designs. Compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages as well as ball grid array (BGA) package types, our aluminum heat sinks and copper heat sinks are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for your natural convection or forced air cooled system. When combined with our other thermal management offerings via a range of customization and integration capabilities, our heat sink portfolio can provide you with a total cooling solution for even the most challenging thermal environments.