Stampings and Extrusions to Improve Heat Dissipation in Your Application

Our stamped and extruded heat sinks are the ideal solution for improving the heat dissipation of both low and high power board level designs. Compatible with TO-218, TO-220, TO-252, and TO-263 transistor package types and available in a variety of standard shapes and sizes, our aluminum heat sinks and copper heat sinks are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal extrusion or stamping for your natural convection or forced air cooled system. When combined with our other thermal management offerings via a range of customization and integration capabilities, our heat sink portfolio can provide you with a total cooling solution for even the most challenging thermal environments.

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