HSB24-252510

HSB24-252510
HSB24-252510 Alternate View

HSB24-252510

25 x 25 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 18.1
Thermal Resistance @ 1 W, nat conv (°C/W) 21.3
Thermal Resistance @ 1 W, 200 LFM (°C/W) 6.5
Thermal Resistance @ 1 W, 400 LFM (°C/W) 4
Power Dissipation @ 75°C ΔT, nat conv (W) 4.14
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 25 x 25 x 10
Dimensions LxWxH (in) 0.98 x 0.98 x 0.39

Technical Docs

Datasheet

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