HSB22-606010

HSB22-606010
HSB22-606010 Alternate View

HSB22-606010

60 x 60 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 7.62
Thermal Resistance @ 1 W, nat conv (°C/W) 7.9
Thermal Resistance @ 1 W, 200 LFM (°C/W) 2.6
Thermal Resistance @ 1 W, 400 LFM (°C/W) 1.6
Power Dissipation @ 75°C ΔT, nat conv (W) 9.84
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 60 x 60 x 10
Dimensions LxWxH (in) 2.36 x 2.36 x 0.39

Technical Docs

Datasheet 3D Model

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