HSB20-353525

HSB20-353525
HSB20-353525 Alternate View

HSB20-353525

35 x 35 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 6.65
Thermal Resistance @ 1 W, nat conv (°C/W) 9.9
Thermal Resistance @ 1 W, 200 LFM (°C/W) 2.7
Thermal Resistance @ 1 W, 400 LFM (°C/W) 1.9
Power Dissipation @ 75°C ΔT, nat conv (W) 11.28
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 35 x 35 x 25
Dimensions LxWxH (in) 1.38 x 1.38 x 0.98

Technical Docs

Datasheet 3D Model

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