Featuring a variety of standard extrusions and stampings, our board level heat sinks are compatible with TO-218, TO-220, TO-252, and TO-263 transistor package types. These stamped and extruded heat sinks are made from aluminum or copper with black anodized, blue anodized, or tin-plated material finishes. Measured under four conditions for thermal resistance, our board level heat sinks support a range of standard shapes and sizes from 8 mm up to 70 mm and profiles from 4 mm up to 45 mm. Our board level heat sinks further offer power dissipation ratings from 1.93 up to 16.7 W at 75°C and vertical or horizontal solder pin orientations as well as no solder pin options.