Ideal for lower power PCB cooling, our stamped aluminum and copper heat sinks are a cost-effective thermal solution for space-constrained applications. Supporting TO-218, TO-220, TO-252, and TO-263 transistor packages, these stampings are available in sizes ranging from 8 mm up to 50.8 mm with heights from 4 mm up to 25.4 mm. Our stamped heat sinks are conveniently measured under four conditions for thermal resistance and carry power dissipation ratings from 2.1 up to 10.29 W at 75°C. These models are constructed from aluminum or copper with black anodized or tin-plated material finishes.