HSE01 Series

HSE01 Series
HSE01-193175 Alternate View
HSE01-193175P Alternate View

HSE01-193175P

Extruded Heat Sink with Thermal Pad, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 25.44
Thermal Resistance @ 1 W, nat conv (°C/W) 29
Thermal Resistance @ 1 W, 200 LFM (°C/W) 9.2
Thermal Resistance @ 1 W, 400 LFM (°C/W) 5.8
Power Dissipation @ 75°C ΔT, nat conv (W) 2.95
Material AL6063-T5
Material Finish Blue Anodized
Thermal Pad Yes
Dimensions LxWxH (mm) 19 x 31.5 x 7.5
Dimensions LxWxH (in) 0.75 x 1.24 x 0.3

Technical Docs

Datasheet

Buy from CUI Devices

Loading...

Shop our distributors

All Thermal Management Categories