HSB09-212115

HSB09-212115
HSB09-212115 Alternate View

HSB09-212115

21 x 21 mm, BGA Heat Sink, Aluminum, PCB


Specifications

Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 17.39
Thermal Resistance @ 1 W, nat conv (°C/W) 23
Thermal Resistance @ 1 W, 200 LFM (°C/W) 6
Thermal Resistance @ 1 W, 400 LFM (°C/W) 4.3
Power Dissipation @ 75°C ΔT, nat conv (W) 4.31
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 21 x 21 x 15
Dimensions LxWxH (in) 0.83 x 0.83 x 0.59

Technical Docs

Datasheet 3D Model

Compliance

RoHS & REACH

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