HSB02-101007

HSB02-101007
HSB02-101007 Alternate View

HSB02-101007

10 x 10 mm, BGA Heat Sink, Aluminum, PCB


Specifications

Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 37.9
Thermal Resistance @ 1 W, nat conv (°C/W) 41.9
Thermal Resistance @ 1 W, 200 LFM (°C/W) 16.5
Thermal Resistance @ 1 W, 400 LFM (°C/W) 12.3
Power Dissipation @ 75°C ΔT, nat conv (W) 1.98
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 10 x 10 x 7
Dimensions LxWxH (in) 0.39 x 0.39 x 0.28

Technical Docs

Datasheet 3D Model

Compliance

RoHS & REACH

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