Micro Audio Components Address the Challenges of Miniaturization


Micro Audio Components Address the Challenges of Miniaturization

This blog post originally published by Ismosys discusses the miniaturization of electronics and the challenges this trend places on design engineers, including finding manufacturers of component-level solutions that match the design requirements of smaller applications.

The post begins, “The miniaturization of electronic applications is certainly not a new trend. Over the past few decades, we have seen computers transform from space-consuming giants into powerful, pocket-sized devices. The ability to place more intelligence into increasingly smaller packages can be attributed in large part to the observations of Moore’s Law. This law states that the number of transistors in a dense integrated circuit (IC) doubles approximately every two years, meaning that more processing power can be packed into ever smaller applications. However, these ICs are only one piece of this shrinking puzzle. The other components that play an important role in mobile/medical devices and consumer electronics, including speakers and buzzers, must keep up with this trend as well.”

CUI’s line of magnetic and piezo transducer micro buzzers housed in packages as small as 4 mm x 4 mm are highlighted as an example of components designed to keep up with the trend of miniaturization, with CUI’s line of compact, low-profile micro speakers providing a solution to the challenge as well.  

The post concludes, “Engineers face a number of pressures and the drive of companies to keep up with the trends of Moore’s Law and miniaturization does not make their jobs any easier. However, manufacturers like CUI with their micro speakers, buzzers and component-level solutions can provide a small, yet crucial piece to address the miniaturization challenge.”

Read the full blog post on ismosys.com