CUI Devices’ innovative arcTEC™ structure combats the effects of thermal fatigue found in thermoelectric modules by incorporating a thermally conductive resin between the electrical interconnect and ceramic on the cold side of the module, high temperature solder, and larger P/N elements made from premium silicon ingot. The combination of these three enhancements greatly improves the reliability, performance, and cycle life of Peltier modules built with the arcTEC structure, allowing them to outperform conventional thermoelectric coolers in the most demanding applications.
This technical paper takes a look at CUI Devices' arcTEC™ structure, found in its line of high performance Peltier modules, versus general Peltier module construction. Learn how the arcTEC structure provides improved performance and reliability, outperforming conventional thermoelectric cooler design.
For more details read the technical paper