HSB18-232310

HSB18-232310
HSB18-232310 Alternate View

HSB18-232310

23 x 23 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 20.41
Thermal Resistance @ 1 W, nat conv (°C/W) 24
Thermal Resistance @ 1 W, 200 LFM (°C/W) 6.8
Thermal Resistance @ 1 W, 400 LFM (°C/W) 4.7
Power Dissipation @ 75°C ΔT, nat conv (W) 3.67
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 23 x 23 x 10
Dimensions LxWxH (in) 0.91 x 0.91 x 0.39

Technical Docs

Datasheet 3D Model

Buy from CUI Devices

Loading...

Shop our distributors

Featured Products

All Heat Sinks Categories