HSB08-212106

HSB08-212106
HSB08-212106 Alternate View

HSB08-212106

21 x 21 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 25.4
Thermal Resistance @ 1 W, nat conv (°C/W) 31.2
Thermal Resistance @ 1 W, 200 LFM (°C/W) 9.7
Thermal Resistance @ 1 W, 400 LFM (°C/W) 6.7
Power Dissipation @ 75°C ΔT, nat conv (W) 2.95
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 21 x 21 x 6
Dimensions LxWxH (in) 0.83 x 0.83 x 0.24

Technical Docs

Datasheet 3D Model

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