HSB06-181810

HSB06-181810
HSB06-181810 Alternate View

HSB06-181810

18 x 1 8mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style Adhesive
Solder Pin Orientation No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 23.68
Thermal Resistance @ 1 W, nat conv (°C/W) 29.1
Thermal Resistance @ 1 W, 200 LFM (°C/W) 8.8
Thermal Resistance @ 1 W, 400 LFM (°C/W) 6.1
Power Dissipation @ 75°C ΔT, nat conv (W) 3.17
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 18 x 18 x 10
Dimensions LxWxH (in) 0.71 x 0.71 x 0.39

Technical Docs

Datasheet 3D Model

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