HSB06-181810

Specifications

• Package Cooled
   
  BGA
• Mounting Style
   
  Adhesive
• Thermal Resistance @ 75°C ΔT, nat conv (°C/W)
   
  23.68
• Thermal Resistance @ 1 W, nat conv (°C/W)
   
  29.1
• Thermal Resistance @ 1 W, 200 LFM (°C/W)
   
  8.8
• Thermal Resistance @ 1 W, 400 LFM (°C/W)
   
  6.1
• Power Dissipation @ 75°C ΔT, nat conv (W)
   
  3.17
• Material
   
  AL6063-T5
• Material Finish
   
  Black Anodized
• Dimensions LxWxH (mm)
   
  18 x 18 x 10
• Dimensions LxWxH (in)
   
  0.71 x 0.71 x 0.39