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Thermal Management
Heat Sinks
BGA Heat Sinks
HSB06-181810
18 x 1 8mm, BGA Heat Sink, Aluminum, PCB
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Custom Thermal Solutions
Specifications
Package Cooled
Not Applicable
Mounting Style
Adhesive
Solder Pin Orientation
No Pin
Thermal Resistance @ 75°C ΔT, nat conv (°C/W)
23.68
Thermal Resistance @ 1 W, nat conv (°C/W)
29.1
Thermal Resistance @ 1 W, 200 LFM (°C/W)
8.8
Thermal Resistance @ 1 W, 400 LFM (°C/W)
6.1
Power Dissipation @ 75°C ΔT, nat conv (W)
3.17
Material
AL6063-T5
Material Finish
Black Anodized
Dimensions LxWxH (mm)
18 x 18 x 10
Dimensions LxWxH (in)
0.71 x 0.71 x 0.39
FEATURED CONTENT
8/31/2021
CUI Devices Expands Heat Sinks Portfolio with New Line of BGA Heat Sinks
How to Select a Heat Sink
How to Select a Heat Sink
Thermal Management Foldout
Heat Sink Calculator
Learn More
8/31/2021
CUI Devices Expands Heat Sinks Portfolio with New Line of BGA Heat Sinks
How to Select a Heat Sink
How to Select a Heat Sink
Thermal Management Foldout
Heat Sink Calculator
Learn More