Specifications


  • Package Cooled
     
    BGA
  • Mounting Style
     
    Adhesive
  • Thermal Resistance @ 75°C ΔT, nat conv (°C/W)
     
    24.01
  • Thermal Resistance @ 1 W, nat conv (°C/W)
     
    28.8
  • Thermal Resistance @ 1 W, 200 LFM (°C/W)
     
    9.6
  • Thermal Resistance @ 1 W, 400 LFM (°C/W)
     
    6.8
  • Power Dissipation @ 75°C ΔT, nat conv (W)
     
    3.12
  • Material
     
    AL6063-T5
  • Material Finish
     
    Black Anodized
  • Dimensions LxWxH (mm)
     
    12 x 12 x 18
  • Dimensions LxWxH (in)
     
    0.47 x 0.47 x 0.71
 
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